MARCH FlexTRAK-2MB
Application：
Electronic Assembly
Semiconductor
Main advantages
The FlexTRAK-2MB system provides the following:
• Pre-flip chip underfill (FCUF), pre-die attach, pre-wire bond, and pre-mold plasma treatment capabilities.
• Patented plasma module for exceptional uniformity and run-to-run process repeatability.
• A unique integrated boat bypass feature for rapid material transfer, up to two boats per plasma cycle.
• Production-ready, dual-lane boat handling.
• Multiple inline plasma modules.
• A compact plasma chamber, short plasma cycle time, and proprietary process control for maximum throughput and minimum cost of ownership.
• Unmatched production flexibility with seamless production line integration and support for a wide range of boat sizes.