Sentronics：SemDexM
Application：
Electronic Assembly
Semiconductor
SemDexM adopts modular design and can be installed according to user needs
Different configurations, multiple sensor probes, measurement platforms, and automation components.
Main advantages
Product application
Wafer thickness (TTV)/multi-layer film thickness measurement
Measurement of wafer curvature, curvature, and flatness (Bow, Warp, Flatness)
3D morphology, key dimension measurement (convex block)
Measurement of aspect ratio of TSV depth
RST thickness measurement
Roughness measurement
Measurement of ultra-thin film thickness