ERSA EXOS 10/26 Vacuum reflow

Application：

Electronic Assembly

Semiconductor

Convection reflow soldering is the preferred connection method worldwide for the surface mounting of electronic assemblies. This is the only method – combined with component development – that guarantees the unstoppable growth of integration density in mobile devices among others. Yet, a transformation from THT components to the SMT world is increasingly taking place in classic areas such as power electronics, too.
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Main advantages

 

Highlights EXOS® 10/26
-- 4-part conveyor (infeed, preheating and peak, vacuum, cooling zone) also as dual track version
-- Perfect synchronisation of the assemblies and transitions thanks to sensor-monitored conveyor, no external infeed module required
-- Maintenance-friendly and lubricant-free roller conveyor in the vacuum module
-- Optimum access to the vacuum chamber through lifting unit from above
-- Optimum temperature profiles through medium-wave emitters in the vacuum module
-- Maximum machine availability thanks to fast removal of the conveyor unit in the vacuum module
-- Part-integrated vacuum pump on separate module carrier for easy and fast maintenance
-- Innovative cleaning system
SMART ELEMENTS®

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