Formic acid soldering system
Application：
Electronic Assembly
Semiconductor
High temperature solder piece process is supported
Soldering temperature Max 450℃
Multiple independent vacuum zones as low as 1KPa
Formic acid injection recovery system
Temperature homogeneity ±3.5℃
The void content can be as low as 1%
Multi-temperature zone formic acid injection system
Main advantages
High temperature solder piece process is supported
Soldering temperature Max 450℃
Multiple independent vacuum zones as low as 1KPa
Formic acid injection recovery system
Temperature homogeneity ±3.5℃
The void content can be as low as 1%
Multi-temperature zone formic acid injection system