OMRON X-RAY
Application：
Electronic Assembly
Semiconductor
The X750 is used for non-destructive inspection of 5G infrastructure/modules and in-vehicle electrical components as a high-definition,
high-quality inspection using full 3D-CT. In recent years, the VT-X750 has been used for inspection of solder voids and solder filling of
through-hole connectors in final assembly of power devices such as IGBTs and MOSFETs, which are essential for EVs, as well as
Integrated machine and electric power. It has also been widely utilized in the fields of aerospace, industrial equipment, and
semiconductors.
Main advantages
The VT-X750 improves upon previous Omron 3D-CT technology making it the fastest X-Ray inspection system to date *¹.
The automated inspection logic has been improved for many parts such as IC heal fillets, stacked devices (PoP), through hole
components, press-fit connectors, and other bottom terminated parts.
Increasing automated inspection speed and expanding inspection logic enables full, in-line inspection coverage by 3D-CT
method.