FUJI NXT-H
Application：
Electronic Assembly
Semiconductor
Main advantages
Can load dies and SMDs with different supply methods
Supports wafers from 4 to 12 inches.These different sizes can
be loaded in the same magazine by using adapters.
Furthermore, up to 16 feeders for tape reels from 4 to 16 mm in
width can be set on the fixed feeder tablle.
Modular concept that supports a many varieties of production types
-- Inherits concepts from the NXT-series;
our best-selling SMT mounter.
-- Flexibly support different production
types for flip chips, small dies, and
large dies just by changing head types.
Supports flip chips and face-up supply
This machine can change between flip chip and face-up
supply production methods as well as supplly up to 25
different wafers.
Automatic pusher pot exchange
This machine is equipped with a
pusher pot changer and flip chip
nozzle changer, so pusher pots and
flip chip nozzles can be
automatically exchanged during
production.
Automatic nozzle exchange
There is a nozzle changer for
automatically changing nozzles to
match the parts being used.