SSP BPS-8200/8200S Ball Placement
Application：
Electronic Assembly
Semiconductor
Ball Placement System for Strip Substrate
Main advantages
-- Magazine Loading
-- Loading pusher forward
-- Loading gripper receive
-- Strip Loading on the Transfer
-- PRS Inspection
-- Flux dipping on the squeegee
-- Flux dotting on the Strip
-- Ball Pick up
-- Ball Tool Inspection
-- Ball placement
-- Ball condition Inspection
Un-Loading to Good conveyor
Un-Loading to reject magazine