LAZIN LODAS™ – BI12
Application：
Electronic Assembly
Semiconductor
Glass wafer inspection system
Main advantages
Features：
For Glass wafer shipping inspection, process evaluation
Simultaneous inspection of front, back and internal defects
Determination and analysis of front and back surface defects using differential interference microscope
Inspection target：12 inches, 8 inches, 6 inches, Glass wafer
Inspection items :Particles on front and back surfaces, internal defects