SHB-220 Ball-Placement System
Application：
Electronic Assembly
Semiconductor
Main advantages
The multi-axis hybrid ball‑diameter ball‑placement system is the first cutting‑edge piece of equipment in China developed specifically to meet the high‑precision requirements of semiconductor packaging. Designed for applications in chip manufacturing and advanced packaging, it breaks through the limitations of conventional single‑head ball‑placement systems.
Its technological bottlenecks have been overcome, integrating “dual-station synchronous operation, ultra-high‑precision positioning, and intelligent closed-loop control,” thereby filling a domestic gap in high‑end ball‑placement equipment.