Company Profile
Founded in 1980, the company is headquartered in Hong Kong and has branches in Shanghai, Suzhou, Shenzhen and Southeast Asia. It is committed to providing low-cost, high-quality manufacturing and service solutions for the electronic assembly and semiconductor industries;
As a leading provider of overall solutions for electronic assembly and semiconductor equipment, we focus on innovative, continuous improvement and cost-effective manufacturing solutions to meet customer needs, specializing in SMT surface mount, hybrid circuits, optoelectronic modules, MEMS, advanced packaging (TSV, Fan-out, etc.), compound semiconductors, microwave devices, power devices, micro-nano and other fields.
At the same time to provide customers with a variety of forms of rental services;
We have an equipment demonstration training center in Suzhou and a professional technical team with an average of more than 18 years of industry experience, providing customers with a series of value-added services such as product samples, capacity simulation analysis and capacity improvement.
development process
Industry division
Consumer Electronics
Smartphone
Smart Wear
Games and Entertainment
Household appliances
Semiconductor
SiP package
WLCSP
multilayer ceramic capacitor
Chip Scale Package
Medical Electronics
Ventilator
CT Diagnosis
ultrasonic diagnosis
Automotive Electronics
In-vehicle entertainment system
Car navigation
Driving assistance
Electronic control
Industry and Communications
IOT Internet of Things
5G base station
Network Firewall
Router, Switch
Data Server
servo control
Security/Control Electronics
Security System
Drone Products
Thermal Imaging
Smart Security
Building intercom